1. 2. 3. material content data sheet sales product name ipw90r1k0c3 issued 29. august 2013 ma# MA000468418 package pg-to247-3-41 weight* 6046.46 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 5.558 0.09 0.09 919 919 leadframe non noble metal iron 7439-89-6 3.972 0.07 657 inorganic material phosphorus 7723-14-0 1.192 0.02 197 non noble metal copper 7440-50-8 3967.074 65.62 65.71 656098 656952 wire non noble metal aluminium 7429-90-5 0.713 0.01 0.01 118 118 encapsulation organic material carbon black 1333-86-4 20.040 0.33 3314 plastics epoxy resin - 380.759 6.30 62972 inorganic material silicondioxide 60676-86-0 1603.198 26.51 33.14 265147 331433 leadfinish non noble metal tin 7440-31-5 31.874 0.53 0.53 5272 5272 plating non noble metal nickel 7440-02-0 29.065 0.48 0.48 4807 4807 solder non noble metal antimony 7440-36-0 0.302 0.00 50 noble metal silver 7440-22-4 0.754 0.01 125 non noble metal tin 7440-31-5 1.961 0.03 0.04 324 499 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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